- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 26/384 - Removing material by boring or cutting by boring of specially shaped holes
Patent holdings for IPC class B23K 26/384
Total number of patents in this class: 120
10-year publication summary
|
8
|
28
|
24
|
15
|
22
|
12
|
11
|
10
|
12
|
2
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Corning Incorporated | 9932 |
9 |
| Siemens AG | 24990 |
4 |
| Omron Corporation | 6968 |
4 |
| Disco Corporation | 1745 |
4 |
| Siemens Energy Global GmbH & Co. KG | 2775 |
4 |
| Rtx Corporation | 8674 |
4 |
| Samsung Display Co., Ltd. | 30585 |
3 |
| Airbus S.A.S. | 819 |
3 |
| CoreSyte, Inc. | 11 |
3 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 585 |
3 |
| General Electric Company | 18133 |
2 |
| International Business Machines Corporation | 60644 |
2 |
| Mitsubishi Heavy Industries, Ltd. | 8217 |
2 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
2 |
| Haute Ecole ARC | 16 |
2 |
| Serenity Data Security, LLC | 11 |
2 |
| Taiwan Green Point Enterprises Co., Ltd. | 51 |
2 |
| GE Infrastructure Technology, LLC | 5873 |
2 |
| WIPOTEC GmbH | 63 |
2 |
| Agc, Inc. | 4029 |
2 |
| Other owners | 59 |